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[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Optimization of lead free solder paste for robust process and reliable solder joint.
Laugt, Anne-marie, Evers, P.C.J., Caban, D, Wilczek, P., Spilka, GYear:
2006
Language:
english
DOI:
10.1109/hdp.2005.251394
File:
PDF, 5.16 MB
english, 2006