3D processing on 6 in. high resistive SOI wafers:...

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 2009 Vol. 607; Iss. 1

3D processing on 6 in. high resistive SOI wafers: Fabrication of edgeless strip and pixel detectors

Simo Eränen, Juha Kalliopuska, Risto Orava, Nick van Remortel, Tuula Virolainen
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
607
Year:
2009
Language:
english
Pages:
4
DOI:
10.1016/j.nima.2009.03.243
File:
PDF, 506 KB
english, 2009
Conversion to is in progress
Conversion to is failed