[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Alloying design of Sn-Ag-Cu solders for the improvement in drop test performance
Li-Wei Lin,, Song, Jenn-Ming, Yi-Shao Lai,, Ying-Ta Chiu,, Lee, Ning-ChengYear:
2008
Language:
english
DOI:
10.1109/emap.2008.4784222
File:
PDF, 4.92 MB
english, 2008