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[IEEE Proceedings., 39th Electronic Components Conference - Houston, TX, USA (22-24 May 1989)] Proceedings., 39th Electronic Components Conference - New low coefficient of thermal expansion polyimide for inorganic substrates
Merriman, B.T., Craig, J.D., Nader, A.E., Goff, D.L., Pottiger, M.T., Lautenberger, W.J.Year:
1989
Language:
english
DOI:
10.1109/ecc.1989.77742
File:
PDF, 362 KB
english, 1989