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[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Characterization of Flip Chip Bump Failure Mode by using High Frequency 230MHz MP and CP4 Transducer
Jiun, Hoh Huey, Shu, Zhang Hai, Ming, XueYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763499
File:
PDF, 4.98 MB
english, 2008