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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Reliability of 20μm micro bump interconnects
You, Ha-Young, Lee, Yoon-Soo, Lee, Sang-Keun, Kang, Ju-SeongYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898575
File:
PDF, 1.73 MB
english, 2011