[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - A Study of Intermetallic Compounds in Tin Bumps during Multi-Reflows
Nie, Lei, Cai, Jian, Peng, Xiao, Zhang, Nan, Wang, Shuidi, Jia, SongliangYear:
2006
Language:
english
DOI:
10.1109/icept.2006.359794
File:
PDF, 3.47 MB
english, 2006