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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Effects of Ni addition on microstructure and the shear strength of Sn-3.0Ag-0.5Cu/Cu solders joints
Lifeng Wang,, Xuwei Shen,, Fenglian Sun,, Yang Liu,Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4607099
File:
PDF, 3.09 MB
english, 2008