[IEEE 2009 IEEE 59th Electronic Components and Technology...

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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Isothermal aging effects on the dynamic performance of lead-free solder joints

Ma, Hongtao, Lee, Tae-Kyu, Kim, Dong Hyun, Kim, Sang Ha, Park, Han G., Liu, Kuo-Chuan
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Year:
2009
Language:
english
DOI:
10.1109/ECTC.2009.5074044
File:
PDF, 3.32 MB
english, 2009
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