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[IEEE 1995 Japan International Electronic Manufacturing Technology Symposium - Omiya, Japan (4-6 Dec. 1995)] Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium - Processing, transfer solder bumping, chip attachment and testing of a thin film Cu/Photo-BCB MCM-D
Ida, Y., Garrou, P.E., Strandjord, A.J.G., Cummings, S.L., Boyd Rogers, W., Berry, M.J., Kisting, S.R.Year:
1996
Language:
english
DOI:
10.1109/iemt.1995.541081
File:
PDF, 471 KB
english, 1996