[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Parametric study for warpage and stress reduction of variable bump types in fcFBGA
Hsieh, Ming-Che, Lee, Chien Chen, Hung, Li Chiun, Wang, Vincent, Perng, HarryYear:
2011
Language:
english
DOI:
10.1109/impact.2011.6117218
File:
PDF, 917 KB
english, 2011