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[IEEE IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (7-11 July 2003)] Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 - Wafer level electromigration testing on via/line structure with a poly-heated method in comparison to standard package level tests
Hin-Kiong Yap,, Kin-Leong Yap,, Yew-Chee Tan,, Keng-Foo Lo,Year:
2003
Language:
english
DOI:
10.1109/ipfa.2003.1222742
File:
PDF, 349 KB
english, 2003