[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Optimization of ultrasound and bond force to reduce pad stress in thermosonic Cu ball bonding
Shah, A., Mayer, M., Zhou, Y., Persic, J., Moon, J. T.Year:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416580
File:
PDF, 1.52 MB
english, 2009