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[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Flexible opto-electrical interconnect module for consumer electronic application

Sheng-Ho Huang,, Chun-Hsing Lee,, Jen-Hao Yeh,, Yuan-Chin Chen,, Yu-Ming Huang,, Fu-Yi Cheng,, Hung-Lien Hu,, Mu-Tao Chu,
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Year:
2008
Language:
english
DOI:
10.1109/emap.2008.4784226
File:
PDF, 5.64 MB
english, 2008
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