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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Differential heating/cooling chip joining method to prevent chip package interaction issue in large die with ultra low-k technology
Sakuma, Katsuyuki, Smith, Kurt, Tunga, Krishna, Perfecto, Eric, Wassick, Thomas, Pompeo, Frank, Nah, Jae-WoongYear:
2012
Language:
english
DOI:
10.1109/ectc.2012.6248866
File:
PDF, 884 KB
english, 2012