![](/img/cover-not-exists.png)
[IEEE Proceedings of the IEEE 2001 International Interconnect Technology Conference - Burlingame, CA, USA (2001.06.6-2001.06.6)] Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) - Nanoglass/sup TM/ E copper damascene processing for etch, clean, and CMP
Zhang, F., Leonte, O., Chen, Z.J., Jin, L., Levert, J.A., Camarena, A., Daniels, B., Dunne, J., Nguyen, T., Ramos, T.A., Thanawala, S.Year:
2001
Language:
english
DOI:
10.1109/iitc.2001.930016
File:
PDF, 330 KB
english, 2001