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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - 3D chip stack with integrated decoupling capacitors
Dang, Bing, Wright, Steven L., Andry, Paul, Sprogis, Edmund, Ketkar, Supriya, Tsang, Cornelia, Polastre, Robert, Knickerbocker, JohnYear:
2009
Language:
english
DOI:
10.1109/ectc.2009.5073987
File:
PDF, 799 KB
english, 2009