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[IEEE IEEE 2005 International Interconnect Technology Conference - Burlingame, CA, USA (6-8 June 2005)] Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005. - Impact of Cu barrier dielectrics upon stress-induced voiding of dual-damascene copper interconnects

Ishikawa, K., Shimazu, H., Oshima, T., Noguchi, J., Tamaru, T., Aoki, H., Ando, T., Iwasaki, T., Saito, T.
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Year:
2005
Language:
english
DOI:
10.1109/iitc.2005.1499916
File:
PDF, 461 KB
english, 2005
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