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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Improved humidity resistance of leaded packages through solder dip process
Seng, Yeoh Lai, Seong, Law Che, Keat, Ng Eng, Hooi, Gooi Boon, Classe, Francis, Li, SusanYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066986
File:
PDF, 1.87 MB
english, 2011