Pressure Contact Micro-Springs in Small Pitch Flip-Chip...

IEEE Transactions on Components and Packaging Technologies 2006 / 12 Vol. 29; Iss. 4

Pressure Contact Micro-Springs in Small Pitch Flip-Chip Packages

Chow, Eugene M., Chua, Christopher, Hantschel, Thomas, Van Schuylenbergh, Koenraad, Fork, David K.
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2006.885959
Date:
December, 2006
File:
PDF, 2.39 MB
english, 2006
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