[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Low temperature Cu/Cu direct bonding using formic gas in-situ treatment
Yang, Wenhua, Akaike, Masatake, Suga, TadatomoYear:
2012
Language:
english
DOI:
10.1109/ltb-3d.2012.6238051
File:
PDF, 986 KB
english, 2012