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[IEEE IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging - West Point, NY, USA (26-28 Oct. 1998)] IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370) - Temperature stable thermoplastic microwave materials and copper laminates
Walpita, L.M., Ahern, M., Chen, P., Goldberg, H., Weinberg, S., Zipp, C., Adams, G., Wong, Y.H.Year:
1998
Language:
english
DOI:
10.1109/epep.1998.733861
File:
PDF, 243 KB
english, 1998