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[IEEE Electrical Performance of Electronic Packaging - Napa, CA, USA (28-30 Oct. 1996)] Electrical Performance of Electronic Packaging - Accurate design of inductors on multi-chip module using high-resistivity silicon substrate
Jenshan Lin,, Zu, L., Frye, R.C., Tai, K.L., Lau, M.Y., Kossives, D., Hrycenko, F., Young-Kai Chen,Year:
1996
Language:
english
DOI:
10.1109/epep.1996.564826
File:
PDF, 297 KB
english, 1996