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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Development of silicon module with TSVs and global wiring (L/S=0.8/0.8µm)
Sunohara, Masahiro, Akinori Shiraishi,, Yuichi Taguchi,, Kei Murayama,, Mitsutoshi Higashi,, Mitsuharu Shimizu,Year:
2009
Language:
english
DOI:
10.1109/ectc.2009.5073992
File:
PDF, 4.47 MB
english, 2009