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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Delamination study on SOIC L/F with high thermal conductivity die attach paste
Xingshou Pang,, Xu, Nathan, Chopin, Sheila, Jinzhong Yao,Year:
2010
Language:
english
DOI:
10.1109/icept.2010.5582467
File:
PDF, 689 KB
english, 2010