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[IEEE 2013 Far East Forum on Nondestructive Evaluation/Testing: New Technology & Application (FENDT) - Jinan, China (2013.06.17-2013.06.20)] 2013 Far East Forum on Nondestructive Evaluation/Testing: New Technology and Application - Properties of copper film characterized by scanning acoustic microscope
Yan, Hongjuan, Peng, Kai, Xu, Chunguang, Lin, QiYear:
2013
Language:
english
DOI:
10.1109/FENDT.2013.6635544
File:
PDF, 190 KB
english, 2013