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[IEEE 2013 22nd Asian Test Symposium (ATS) - Yilan County, Taiwan (2013.11.18-2013.11.21)] 2013 22nd Asian Test Symposium - Post-bond Testing of the Silicon Interposer and Micro-bumps in 2.5D ICs
Wang, Ran, Chakrabarty, Krishnendu, Eklow, BillYear:
2013
Language:
english
DOI:
10.1109/ats.2013.36
File:
PDF, 1.11 MB
english, 2013