[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Effect of microstructure evolution on Pb-free solder joint reliability in thermomechanical fatigue
Yin, Liang, Meilunas, Michael, Arfaei, Babak, Wentlent, Luke, Borgesen, PeterYear:
2012
Language:
english
DOI:
10.1109/ectc.2012.6248876
File:
PDF, 967 KB
english, 2012