[IEEE 2014 15th International Conference on Thermal,...

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[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments

Hartmann, Steffen, Holck, Ole, Blaudeck, Thomas, Hermann, Sascha, Schulz, Stefan E., Gessner, Thomas, Wunderle, Bernhard
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Year:
2014
Language:
english
DOI:
10.1109/eurosime.2014.6813830
File:
PDF, 671 KB
english, 2014
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