[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Macurova, Katerina, Angerer, Paul, Schongrundner, Ronald, Krivec, Thomas, Morianz, Mike, Antretter, Thomas, Bermejo, Raul, Pletz, Martin, Brizoux, Michel, Maia, WilsonYear:
2014
Language:
english
DOI:
10.1109/eurosime.2014.6813794
File:
PDF, 874 KB
english, 2014