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[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Flip chip assembly on PCB substrates with coined solder bumps
Jae-Woong Nah,, Paik, K.W., Soon-Jin Cho,, Won-Hoe Kim,Year:
2003
Language:
english
DOI:
10.1109/ectc.2003.1216283
File:
PDF, 987 KB
english, 2003