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[ECS ISTC/CSTIC 2009 (CISTC) - Shanghai, China (March 19 - March 20, 2009)] ECS Transactions - Reliability of Copper Interconnects: Stress-Induced Voids
Gambino, Jeff, Lee, Tom C., Chen, Fen, Sullivan, Timothy D.Year:
2009
Language:
english
DOI:
10.1149/1.3096451
File:
PDF, 690 KB
english, 2009