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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Laser bonding system for semiconductor device and MEMS encapsulation
Huang, Yuanhao, Li, Maoyu, Lai, Yuneng, Chen, Zunmiao, Zhang, JianhuaYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066938
File:
PDF, 1.29 MB
english, 2011