Forward and Backward Compatibility of Solder Alloys With...

IEEE Transactions on Electronics Packaging Manufacturing 2007 / 04 Vol. 30; Iss. 2

Forward and Backward Compatibility of Solder Alloys With Component and Board Finishes

Kannabiran, Anand, Pannerselvam, Elavarasan T., Ramkumar, S. Manian
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Volume:
30
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2007.899120
Date:
April, 2007
File:
PDF, 1.63 MB
english, 2007
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