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Corrections to "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process"
Kay, Robert W., Stoyanov, Stoyan, Glinski, Greg P., Bailey, Chris, Desmulliez, Marc P. Y.Volume:
30
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2007.895649
Date:
June, 2007
File:
PDF, 111 KB
english, 2007