Corrections to "Ultra-fine pitch stencil printing for...

Corrections to "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process"

Kay, Robert W., Stoyanov, Stoyan, Glinski, Greg P., Bailey, Chris, Desmulliez, Marc P. Y.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
30
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2007.895649
Date:
June, 2007
File:
PDF, 111 KB
english, 2007
Conversion to is in progress
Conversion to is failed