[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Analysis and compensation of perpendicularity error for high speed and high precise IC assembly equipment base on coordinate transformation
Qin, Haichen, Quan, Jianzhou, Peng, Bo, Yin, ZhoupingYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270571
File:
PDF, 1.01 MB
english, 2009