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[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Area-I/O RDL routing for chip-package codesign considering regional assignment
Lin, Kun-Sheng, Hsu, Hsin-Wu, Lee, Ren-Jie, Chen, Hung-MingYear:
2010
Language:
english
DOI:
10.1109/edaps.2010.5683021
File:
PDF, 310 KB
english, 2010