[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Electromigration analysis of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
Orii, Yasumitsu, Toriyama, Kazushige, Kohara, Sayuri, Noma, Hirokazu, Okamoto, Keishi, Toyoshima, Daisuke, Uenishi, KeisukeYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898535
File:
PDF, 1.81 MB
english, 2011