[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Characterization and Modeling of Hygroscopic Swelling and its Impact on Failures of a Flip Chip Package with No-flow Underfill
Jiang Zhou,, Tong Yan Tee,, Xueren Zhang,, Jing-en Luan,Volume:
2
Year:
2005
Language:
english
DOI:
10.1109/eptc.2005.1614466
File:
PDF, 4.14 MB
english, 2005