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Nano-to-millimeter scale integrated systems
Last, H.R., Deeds, M., Garvick, D., Kavetsky, R., Sandborn, P.A., Magrab, E.B., Gupta, S.K.Volume:
22
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.774758
Date:
June, 1999
File:
PDF, 229 KB
english, 1999