![](/img/cover-not-exists.png)
Tensile Strength of Joints Bonded With a Nano-particle-Reinforced Adhesive
Park, Sang Wook, Kim, Byung Chul, Lee, Dai GilVolume:
23
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1163/156856108X344063
Date:
January, 2009
File:
PDF, 12.82 MB
english, 2009