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[IEEE 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, USA (2009.03.15-2009.03.19)] 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - A novel copper bead heat sink for computer cooling
Meng-Chang Tsai,, Shung-Wen Kang,, Chih-Hsien Lin,Year:
2009
Language:
english
DOI:
10.1109/stherm.2009.4810768
File:
PDF, 940 KB
english, 2009