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[IEEE 2011 Semiconductor Conference Dresden (SCD) - Dresden, Germany (2011.09.27-2011.09.28)] 2011 Semiconductor Conference Dresden - Characterization of barrier and seed layer integrity for copper interconnects
Wojcik, Henry, Lehninger, David, Neumann, Volker, Bartha, Johann W.Year:
2011
Language:
english
DOI:
10.1109/scd.2011.6068735
File:
PDF, 1.29 MB
english, 2011