[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint
Chenniki, Walide, Bord-Majek, Isabelle, Levrier, Bruno, Wongtimnoi, Komkrisd, Diot, Jean-Luc, Ousten, YvesYear:
2014
Language:
english
DOI:
10.1109/eurosime.2014.6813805
File:
PDF, 762 KB
english, 2014