Circuit Models for Power Bus Structures on Printed Circuit...

IEEE Transactions on Advanced Packaging 2006 / 08 Vol. 29; Iss. 3

Circuit Models for Power Bus Structures on Printed Circuit Boards Using a Hybrid FEM-SPICE Method

Guo, C., Hubing, T.H.
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2006.875089
Date:
August, 2006
File:
PDF, 495 KB
english, 2006
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