[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Thermocompression bonding of Ag-MWCNTs nanocomposite films as an alternative die-attach solution for high temperature packaging of SiC devices
Smet, Vanessa, Jamal, Mamun, Mathewson, Alan, Razeeb, Kafil M.Year:
2012
Language:
english
DOI:
10.1109/ectc.2012.6248833
File:
PDF, 2.10 MB
english, 2012