Fundraising September 15, 2024 – October 1, 2024 About fundraising

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China...

  • Main
  • [IEEE High Density Packaging...

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Electrical simulation and measurement of IPD with multilayer thin film technology for WLP

Siew, Glen, Soh, Serine, Tee, Tong Yan, Chen, Haoyang, Kang, In Soo, Kim, Jong Heon
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2011
Language:
english
DOI:
10.1109/icept.2011.6066918
File:
PDF, 4.49 MB
english, 2011
Conversion to is in progress
Conversion to is failed