[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Electrical simulation and measurement of IPD with multilayer thin film technology for WLP
Siew, Glen, Soh, Serine, Tee, Tong Yan, Chen, Haoyang, Kang, In Soo, Kim, Jong HeonYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066918
File:
PDF, 4.49 MB
english, 2011