[IEEE 2011 IEEE Electrical Design of Advanced Packaging and...

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[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - A novel method for low impedance design of power and ground planes

Ling-Song Zhang,, Xing-Chang Wei,, Meng Ni,, Er-Ping Li,
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Year:
2011
Language:
english
DOI:
10.1109/edaps.2011.6213731
File:
PDF, 268 KB
english, 2011
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