Development of 25-$\mu{\rm m}$-Pitch Microbumps for 3-D...

IEEE Transactions on Components Packaging and Manufacturing Technology 2012 / 11 Vol. 2; Iss. 11

Development of 25-$\mu{\rm m}$-Pitch Microbumps for 3-D Chip Stacking

Aibin Yu,, Kumar, A., Soon Wee Ho,, Hnin Wai Yin,, Lau, J. H., Su, Nandar, Khong Chee Houe,, Jong Ming Ching,, Kripesh, V., Chen, S., Chien-Feng Chan,, Chun-Chieh Chao,, Chi-Hsin Chiu,, Chang-
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Volume:
2
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2012.2203130
Date:
November, 2012
File:
PDF, 1.46 MB
english, 2012
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