[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - Reliability Analysis of the Panel Base Package (PBP¿) Technology with Enhanced Cover Layer
Yew, Ming-Chih, Yu, Chun-Fai, Tsai, Mars, Hu, Dyi-Chung, Yang, Wen-Kun, Chiang, Kuo-NingYear:
2008
Language:
english
DOI:
10.1109/impact.2008.4783842
File:
PDF, 4.94 MB
english, 2008